Printed Circuit Board with BGA package
Hi,
BGA is ball grid array packaging technology, high density surface assembly packaging technology. It's a type of surface-mount packaging used for integrated circuits(IC). They can be found in many interconnection pins devices such as microprocessors, communication equipment and control industrial machinery etc.
Advantages
High density saves the soldering space. It greatly avoid the danger of accidentally bridging adjacent pins with solder grew.
Function is increased due to the increase in the number of pins
Easy to let tin on pads when solder melts on PCB due to its self-centering
High reliability and good electrical performance
The heat conduction is much better than the packages with legs between the PCBs
Characters
Many micro vias are used
Via finished diameter ranging 8 to 12mil.
Vias are needed to be plugged, no solder mask onto BGA pads and no drill on BGA pads.
PCB Service:
1) Multilayer PCB on FR-4 Tg135℃, Tg170℃,RO4350B, RO4003C
2) Prototype, small runs and mass production
3) Various surface finishes: HASL, Immersion gold, Immersion tin, Immersion silver, OSP
4) Various solder mask: Green, Blue, Matt blue, Red, Yellow, Black, Matt black, White
5) Door to door shipment
If you have requirement on BGA PCBs, please do not hesitate to contact us by simply reply back to this email.
Natalie Xue | Business development
Bicheng PCB | sales@bichengpcb.com |Material partners: Rogers, Taconic, ITEQ, SHENGYI, TAIYO, KUANGSHUN
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Bicheng is located at Baoan, Shenzhen, China 518103.
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