Senin, 10 Agustus 2020

High Frequency PCB Built on RO4003C With Via in Pad and 50ohm Impedance Control

Multilayer PCB 6 Layer Hybrid PCB Built On Rogers 10mil RO4350B and FR-4

 

Hi Manager,

Do you often use high frequency PCB for your RF device?

Today, I'll show you a type of 6-layer mixed PCB built on 2 core of RO4350B and 1 core of FR4.

 

Basic specifications

Base material: RO4350B 10mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L1-L3, L1-L4

Format: 82mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: No

Final PCB height: 1.4 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

Stack up:

 

We can provide you with prototypes, small runs and mass production services. If you have any enquiries, please feel free to contact me.

 

Best regards

 

Kevin Liao | Business development

Bicheng PCB | sales@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN

If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as "remove" in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

 

 

At 2020-05-18 10:31:00, "bichengpcb | RF PCB" <sales@bichengpcb.com> wrote:

 

 

High Frequency Multilayer PCB Built on Rogers 20mil RO4350B and FR-4

 

Dear Manager,

This is a type of 6 layer hybrid PCB (Mixed PCB) built on 2 core of RO4350B and 1 core of FR4 for the application of 4G Signal Booster.

 

Basic specifications

Base material: RO4350B 20mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L5-L6

Format: 100mm x 120mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm| Inner layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.8 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

Stack up:

 

We can provide you with prototypes, small runs and mass production services. If you have any enquiries, please feel free to contact me.

 

Best regards

 

Kevin Liao | Business development

Bicheng PCB | sales@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN

If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as "remove" in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

 

 

At 2020-03-16 14:41:00, "bichengpcb | RF PCB" <sales@bichengpcb.com> wrote:

 
 
 

4 Layer RF Circuit Board Made on Rogers 60mil RO4350B and 10mil RO4350B

 

Hi Manager,

This is a type of 4 layer high frequency PCB built on 2 cores of RO4350B and 1 sheet of prepreg (RO4450F) for the application of UHF coupler.

 

Basic specifications

Base material: RO4350B 60mil + RO4350B 10mil + RO4450F 4mil

Layer count: 4 layers

Type: Control depth Back drill L2-L4

Format: 100mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: Green / White

Final PCB height: 2.1 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

Stack up:

 

We can provide you with prototypes, small runs and mass production services. If you have any enquiries, please feel free to contact me.

 

Best regards

 

Kevin Liao | Business development

Bicheng PCB | sales@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN

If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as "remove" in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

 
At 2019-02-15 13:40:00, "bichengpcb | RF PCB" <sales@bichengpcb.com> wrote: 

 

BGA PCB

Hi Manager,

BGA is ball grid array packaging technology, high density surface assembly packaging technology. It's a type of surface-mount packaging used for integrated circuits(IC). They can be found in many interconnection pins devices such as microprocessors, communication equipment and control industrial machinery etc.

 

Advantages

a)    High density saves the soldering space. It greatly avoid the danger of accidentally bridging adjacent pins with solder grew.

b)    Function is increased due to the increase in the number of pins

c)    Easy to let tin on pads when solder melts on PCB due to its self-centering

d)    High reliability and good electrical performance

e)    The heat conduction is much better than the packages with legs between the PCBs

 

Characters

1)    Many micro vias are used

2)    Via finished diameter ranging 8 to 12mil.

3)    Vias are needed to be plugged, no solder mask onto BGA pads and no drill on BGA pads.

 

PCB Service:
1) Multilayer PCB on FR-4 Tg135
, Tg170,RO4350B, RO4003C

2) Prototype, small runs and mass production

3) Various surface finishes: HASL, Immersion gold, Immersion tin, Immersion silver, OSP

4) Various solder mask: Green, Blue, Matt blue, Red, Yellow, Black, Matt black, White

5) Door to door shipment

 

If you have requirement on BGA PCBs, please do not hesitate to contact us by simply reply back to this email.

 

Kevin Liao | Business development

Bicheng PCB | sales@bichengpcb.com |Material partners: Rogers, ITEQ, SHENGYI, TAIYO, KUANGSHUN

If you do not want to receive emails from Bicheng about marketing communications and special offers, reply as "remove" in the subject line.

 

Bicheng is located at Baoan, Shenzhen, China 518103.

Tidak ada komentar:

Posting Komentar